ISSN: 2376-130X
Dr. Peng Wang, MD
Executive Editor
Senior Engineer, Qualcomm Technologies, Inc.
Cornell University, Ithaca, NY, USA
Dr.Peng Wang obtained his Bachelor’s degree in 2006 from Tsinghua University (China) in chemical engineering and proceeded to pursue a graduate study at Cornell University. During this period of time, he had a very broad academic interest spanning fluid mechanics, solid mechanics, mass transfer, electrochemistry, and semiconductor electro migration, and had contributed journal publications in each of these fields from a theoretical and computational perspective. After graduation, He worked at Intel Corporation and subsequently at Qualcomm Technologies. One of his key contributions at Intel Corporation was to study large panel warpage from an experimental as well as mathematical modeling point of view.
Currently he is interested in all semiconductor related research topics.